dpaci.com

Headquarters
2251 Ward Ave.
Simi Valley,CA  93065
UNITED STATES

[email protected]

DPA Components Int'l.

Vendor

    Services offered:
    • Analysis
    • ASIC Design
    • Assembly
    • Ball Grid Array Assembly
    • Bonding (Including Ultrasonic)
    • Die Cutting
    • Electronic Data Interchange
    • Etching
    • Failure Analysis
    • Gate Array Design
    • Hybrid Circuit Assembly
    • ICs, Custom
    • ICs, Packaging
    • ICs, Testing
    • Just-In-Time Deliveries
    • Lead Forming
    • Marking & Component Printing
    • Materials Management
    • Memory Modules, Custom
    • Packaging (Military or Other)
    • Particle Impact Noise Detection Testing (PIND
    • PLD, CPLD & FPGA Programming
    • Programming of PROMs, EPROMs
    • Purchasing Services
    • RF Testing
    • Software Design & Maintenance
    • Tape & Reel
    • Testing
    • Testing to MIL-SPECs
    • Tinning
    • Wafer Backgrinding & Polishing
    • X-Ray Services