halcyonmicro.com

Headquarters
5467 Second St.
Irwindale,CA  91706
UNITED STATES

[email protected]

Halcyon Microelectronics

Vendor

    Services offered:
    • Assembly
    • Bonding (Including Ultrasonic)
    • Chip on Board
    • Contract Manufacturing, General
    • Hybrid Circuit Assembly
    • ICs, Packaging
    • ICs, Testing
    • Just-In-Time Deliveries
    • Microprocessor Development
    • Packaging (Military or Other)
    • Printed Circuit Boards
    • Prototypes
    • Silkscreening
    • Soldering & Desoldering
    • Surface Mount Assembly
    • Testing
    • Testing to MIL-SPECs
    • Turnkey Mfg.
    • Wafer Backgrinding & Polishing
    • Wafer Dicing & Scribing